| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board temperature is high and ambient is lower so any heat conduction away from the micro will help. | | Usual rules, minimal cost, no assembly issues, readily available.... | Any number stock heat sinks would be available from the usual suspects. Try one made for a TO-220 device. We use this solution on a PQFP 80 DSP chip that was uncomfortably hot before sinking. Measurements and calculations showed that it worked better than you would expect. We use Loctite 383 thermally conductive adhesive to attach the sink. We haven't had one come off yet.| | | Charles,
Dont know if this is any help but I looked at an alternative to using the loctite adhesive. The main reason is that if you apply the heatsink after ICt and have to go back and test it..getting the heat sink off is a dam hard thing to do. I found a conductive pad by a company called Wrath International. You can have it cut to custome sizes if you need to but I think a QFP160 is available. The assembly time is practically zero, the adhesion is great and you can rip it off easy enough if you need to rework the board after. I've got the address at work so if you cant find it on the net give me a shout.
JohnW
reply »