I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dimes to dollars that Juki(Zeva), Tenyru (Amistar) or Yamaha (Philips) can not provide a 3 sigma process. Drive mechanism aside the linear encoder on the axis is the way to go but the run out in the Z axis and the force control in the Z prevents the use of these machine. YOU GET WHAT YOU PAY FOR. 8 mil pitch FC attach requires accuracy of +/- 25microns or better, guys we are talking Die Bonders. Users want a $150K machine to do FC, .012" pitch and 30K/ hour and there will always be someone who will say "sure we can do that" (once, but not in production and only when the Moon (not Earl) is in the right phase) The old saying goes, "If you try to be all things to all people, you end up being nothin to nobody" Thanks
reply »