Hi folks,
What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have checked CTE, epoxy resin -polymer crystallization, rheology, electrical properties/parameters...(some of the units are not similar at all!)- - Appreciate any kinda help -.
Thanks in advance Regards Kc.
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