Type: |
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Date: |
Thu, Jun 28 - Fri, Jun 29, 2012
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Description: |
By Order of Leading Global Electronic OEMs, Semiconductor, and Electronic Manufacturing Services (EMS) Companies
Electronics manufacturing monthly auction featuring semiconductor fabrication, test & measurement from a World Class Semiconductor Manufacturer, Philips, TE Connectivity, Continental, and other global sellers
Featuring:
Philips - San Jose, CA
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(2) CHA Industries SE-600-RAP Ion Beam Evaporator
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(2) Canon/Neutronics PLA-501 Mask Aligner
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Karl Suss 12300039 Contact Aligner
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Trion Oracle ICP Etch System
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Trion Oracle ICP Etch Cluster Tool
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SpeedFam 32BTAW 32" Lapper
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SpeedFam 32SPAW 32" Lapper
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SpeedFam 32DGW 32" Lapper
TE Connectivity - Mansfield, OH
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Faro F04 Gage Plus Robotic Arm / Portable CMM
Continental - Dearborn, MI
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Sikama Falcon 8500 Reflow Solder/Curing Oven
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ATV Technologies SRO-706 Vacuum Reflow Oven
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Essemtec FLX2010 Pick & Place Machine
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Trek Triton Aqueous Electronics Assembly Cleaning System
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Speedprint SP100 Solder/Screen Printer
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(3) Orthodyne Electronics M360C Wire Bonder
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(3) Blue M DC-136-C-MP550 Electric Oven
World Class Semiconductor Manufacturer - Hayward, CA
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Axcelis Fusion ES3 Dual-Chamber Plasma Asher, 300mm
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ThermaWave OptiProbe 2600B Film Measurement System
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KLA Tencor 2132 Wafer Inspection System
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M+W Zander / Steag HamaTech 9280000 Advanced Single Substrate Processor
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Agilent 1100 Series HPLC
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BOC Edwards iH1800 Vacuum Pump System
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BOC Edwards iH1000 Vacuum Pump System
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(8) BOC Edwards iH600 & iL600 Vacuum Pump Systems
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(2) BOC Edwards iQDP80/QDP1200 Vacuum Pump Systems
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(8) BOC Edwards iQDP80/QDP250 Vacuum Pump Systems
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(10) BOC Edwards iL70N Vacuum Pump Systems
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(2000+) 300mm FOSBs (front-opening shipping boxes)
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Link: |
http://www.go-dove.com/en/event-16140/Electronic-Manufacturing-Exchange-156-Auction-North-America |