National Semiconductor Auction
Type: |
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Date: |
Tue, Mar 14 - Thu, Mar 16, 2006 |
Description: |
High Quality ATE and Assembly Equipment. Featuring: Vanguard VAi 6300 BGA Solder Ball Placement Line, (6) Camalot 5700 In-Line Dispensing Systems, Esec Micron 2 Die Attacher, (2) Esec CT2000 Pick & Place System, Shibuya SBM210 BGA Solder Ball Mounting system, Heller 1900W & 1500W Reflow Ovens.
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Link: |
http://www.thomasauction.com/auctions/auction.cfm?intProjectID=36 |
Company Information: