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  • Online Auction: Flip Chip Bonder and Pick N Place Machine from a Multinational High Technology Manufacturer

Online Auction: Flip Chip Bonder and Pick N Place Machine from a Multinational High Technology Manufacturer

Type:

Date:

Tue, Jan 19 - Fri, Jan 22, 2016

This auction is expired - [Visit upcoming smt - pcb equipment auctions]

Description:

Online Auction
Flip Chip Bonder and Pick N Place Machine from a Multinational High Technology Manufacturer

Sale Close: 22 January, 2016

Featuring:
Flip Chip Bonder
● TDK 'AFM-15' (Qty 10, 2012)

Pick & Place 
● Alantac 'NMCPP-001-AEM' (Qty 8, 2012)
● w/ Yamaha 'YK400XG' robot

Viewing by appointment only

Contact Info:
Liew Yew Soon
Tel:  +6012-6237704
Email:  help@go-dove.com

Link:

http://www.go-dove.com/en/events?cmd=details&event=651019&utm_source=smtnet.com&utm_medium=adpost&utm_campaign=651019

Company Information:

AllSurplus is the world's leading marketplace for business surplus, ranging from heavy equipment and industrial machinery to electronic manufacturing and aerospace surplus. A scalable platform to manage buying or selling surplus.

Bethesda, Maryland, USA

Consultant / Service Provider, Equipment Dealer / Broker / Auctions

  • Phone 202-467-6868

See Company Website »

Company Postings:

(3) products in the catalog

(4) news releases

Online Auction: Flip Chip Bonder and Pick N Place Machine from a Multinational High Technology Manufacturer auction has been viewed 7 times.

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  • Online Auction: Flip Chip Bonder and Pick N Place Machine from a Multinational High Technology Manufacturer
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Cost-effective Conformal Coating Machine