Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
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Date: |
Wed, April 18 - Thu, April 19, 2018 |
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Description: |
The stencil printing process is the most critical process in surface mount electronics assembly. It tremendously influences the quality of the final PCB assembly. This course will provide a thorough understanding of the print process for lead based and lead free solder paste print applications. Topics include an in-depth look at stencils, solder paste, squeegee, process parameters, process characteristics, inspection techniques, defect identification and corrective actions. Participants in this course are sure to acquire a sound understanding of the solder paste print process and its influence on yield. A brief discussion on the use of this process for adhesive print applications is also included. Who Should Attend:
After completing this course, you will be able to:
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https://smta.org/education/presentations/presentations.cfm#stencilprinting |
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