SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
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Date: |
Thu, June 14 - Fri, June 15, 2018 |
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Description: |
Two 90 minute Sessions, June 14 and 15, 2018 1:00pm to 2:30pm Eastern Presented by: S. Manian Ramkurar, Ph.D., Center for Electronics Manufacturing and Assembly This course will provide an introductory but hollistic understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, troubleshooting and process control. Design for ease of manufacture and assembly will be discussed throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. A comparison of lead based and lead free process will be provided, including implementation issues. Who Should Attend:
After completing this course, you will be able to:
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Url: |
https://smta.org/education/presentations/presentations.cfm#fundamentals |
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