BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
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Mon, March 16, 2020 |
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Description: |
Ball Grid Array or area array packages have been used in the industry for many years and are widely available for commercial and military applications. Everyone blames the BGA for failure, often because you can’t see under the package but is it the real failure in your process? Bob will outline the correct assembly process, the most common failure modes and corrective action. Just like surface mount, the use of BGAs can affect printed board layout, assembly, inspection and repair process. However, BGAs provide significant advantages over fine pitch components on assembly yield. Topics include:
After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar. |
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