DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
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Date: |
Wed, August 19, 2020 |
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free |
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Description: |
Wednesday, August 19th, 2020 @ 1:00 PM (US Eastern) Presenter: Norman Armendariz, Ph.D., Raytheon Company Overview Certain components or package configurations were observed to exhibit more entrainment and/or entrapment of cleaning residues. This paper will discuss the “physics” of liquid entrainment / entrapment and their effects on component materials with experiments performed to determine the minimum amount of component vent area required to adequately rinse components of their cleaning residues resulting in a “Design for Rinse-ability” specifications or guidelines to deploy. In addition, accelerated humidity testing with electrical testing will be discussed, that was performed to determine the degree of degradation / corrosion or electrical reliability of components exposed to controlled or known amounts of cleaning solutions entrained. |
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