BGA & Area Array Failures, Causes & Corrective Actions Online Webinar


Online Events


Mon, March 16, 2020


Ball Grid Array or area array packages have been used in the industry for many years and are widely available for commercial and military applications. Everyone blames the BGA for failure, often because you can’t see under the package but is it the real failure in your process?  Bob will outline the correct assembly process, the most common failure modes and corrective action. Just like surface mount, the use of BGAs can affect printed board layout, assembly, inspection and repair process. However, BGAs provide significant advantages over fine pitch components on assembly yield.

Topics include:

  • Modern Lead-Free Assembly Processes
  • Issues with Plastic BGA, Ceramic BGA, Column Grid Array, Land Grid Arrays
  • Lead-free and tin/lead paste
  • Moisture cracking
  • Effect of incorrect profiling
  • Head in or on Pillow
  • Secondary reflow
  • Hot tearing of joints
  • Voiding in solder joints

After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session.

The webinar will run for between 60-90min with question and answer session. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar.


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Stafford, Texas

SMTA Houston Expo & Tech Forum

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Reflow Simulation – X-ray & Optical Help Solves Design & Process

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Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar

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