Rework Symposium

Kester is hosting a Technical Rework Seminar, scheduled to take place Tuesday, March 7 at Kester’s Global Headquarters in Itasca, IL.

The Technical Rework Seminar will cover Alternative Methods for BGA Rework Solder Paste and Flux Application; Rework Challenges for Leading Edge Components BGA, QFN and LED in Today’s Fast Moving Industry; Surface Insulation Resistance of No-Clean Flux Residue Under Various Surface Mount Component; Rework Flux - Application and Reliability; and Benchtop PCB Repair.
Kester’s Technology Manager, Denis Jean, Bob Wetterman from BEST, Paul Wood from Metcal and Grant Price from Chemtronics will be presenting.

For more information or to RSVP for the seminar, contact Michelle O’Brien at mobrien@kester.com.