SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data

Category

Conferences

Date:

Thu, January 10, 2019

Location:

Zestron Corporation, Manassas, Virginia

Description:

The SMTA Capital Chapter is excited to host a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at ZESTRON, Manassas, VA. Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data.”

This presentation will provide an overview of the vacuum reflow process and explain the reason vacuum reflow is of interest to the electronic assembly industry.  The presentation will also include a report on preliminary data from a void reduction experiment completed at the Universal Instruments Process Laboratory.

Fred Dimock, Manager of Process Technology at BTU International in Massachusetts, has extensive experience in thermal processing and has assisted many companies with process refinements over the years. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. He also wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification” by Dr Lasky and Jim Hall. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.

Don’t miss out on dinner and a facility tour prior to the presentation. Registration is free for members and $30 for non-members. The registration fee will be waived if you join the Capital Chapter during this event!

Url:

https://smta.org/chapters/chapters_detail.cfm?chapter_id=14

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