SMTA Dallas Chapter - Understanding Selective Solder Technology

Selective soldering technology, specifically nitrogen inerted, liquid underside selective soldering has emerged as a required process in PCB manufacturing. The industry has become segmented in approach driving separate technology roadmaps that encompass, topside laser, soldering iron, mixed technology and bottom side liquid flow soldering.

This presentation explains the underlying process needs and the resulting technologies required to serve those requirements as it relates to the underside liquid soldering.

Presenter: Jonathan is the President of Pillarhouse USA with P&L responsibility for the Americas and is a director of the Selective Soldering Academy. He has a BSME from Western New England University and has over 20 years of selective soldering process experience. Jonathan has been published in several trade publications including, US Tech, SMT Magazine, Global SMT and Packaging, The Suit, EMS Now and others. He has received the Ford Award of Excellence for Automotive Electronics, is a member of the SMTA and EMCWA and regular contributes on the subject of selective soldering.