Category |
Online Events |
Date: |
Thu, April 08, 2021
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Admission: |
free |
Description: |
Chapter Meeting
Flexible Wave Solder Processes and Optimization
Presented By David Phillips
About the Topic:
- Implementation of Flexible Wave solder process utilizing parallel processing of multiple products.
- Introduction of Flexible Centralized Through Hole process reducing labour, optimizing efficiency and quality.
- Development of process, profiles to accommodate multiple product parallel processing.
- Developing custom wave carriers to accommodate all existing solder pallets. Standardizing carrier sizing for standard conveyor width and thermal balance.
- Designing the process: Common pre-heat for slow response heaters; dynamic quick response heaters used for adjustment of pre-heat and dynamic wave profile.
- Closed loop conveyance system supporting up to 8 slide lines for different products, as well as, having underside pallet cooling.
About the Speaker:
- 30 years in industry. Process Engineering; Technical Project Management and Reverse Logistics.
- US Patent Holder for “Non-Contact Induction Reflow”.
- Well versed/experienced in all electronic assembly processes.
- OEM and CEM Background.
- OEM: 11 years @ Blackberry (9) and Unitron (2)
- CEM: 19 years in CEM Environments, Sanmina-SCI, Flextronics and Creation.
- Managed multiple Global facility qualifications and partnership introductions; providing Engineering, technical and operational leadership and guidance.
Date: Thursday, April 8, 2021
Time: 4:00 Pm - 5:00 pm (Central Time)
Location: Virtual
Meeting URL: TBD
Cost: FREE
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Url: |
https://smta.org/events/EventDetails.aspx?id=1501004&group=
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