Electronic Packaging Engineer

Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and network support products and systems for global communications markets. This opportunity is available in Melbourne, Florida, on the Atlantic Coast, and only 45 minutes south east of Orlando: home of Disney, Sea World, and Universal Studios. The cost of living is low and housing is very affordable. If you love to fish, boat, jet ski, sun on the beach, or just enjoy the outdoors, Melbourne is the place for you! Located south of Cape Canaveral on Florida�s beautiful �Space Coast,� Harris offers a dynamic and creative technical environment, incredible growth opportunities, competitive compensation and tremendous benefits.

The NEW Harris combines the wide-ranging technical and business resources of the company into a single high-technology enterprise focused on worldwide communications markets. As we continue to be a pioneer in cutting edge technology, it is our intention to be focused, agile, and flexible in order to react quickly to today�s dynamic, fast-moving communications requirements. Come and grow with the NEW HARRIS!

Qualifications: Candidate must have extensive hands-on experience in one or more of the following key technologies: 1) Electronic packaging, 2) the high volume manufacturing of RF systems (modems, converters, phased array antennas, transceivers), 3) opto-mechanical and photonics assembly using semiautomatic and automatic nanopositioning devices. The following are highly desired: In depth knowledge of RF packaging techniques, T/R Modules, RF interconnects, MMIC wire and ribbon bonding, RF PWB design and construction, LTCC and thin film substrate technologies, and RF materials. Recent experience in the implementation of ball grid array, chip scale, chip-on-board, multichip module, eutectic die attach, flip chip technologies and related manufacturing processes. Demonstrated proficiency in the planning and execution of complex technical tasks and development projects is required.

Responsibilities: Work on the development, qualification, and implementation of electronic packaging, RF manufacturing, and photonics assembly processes. Support IR&D and Program activities Division wide.