Electronics Assembly Jobs

Manufacturing Engineer

Date Posted:

January 13, 2005

Job Category:

Engineering

Company Division:

RF Communications Division

Location:

Rochester, New York, USA

Job Description:

Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes. Interfaces with engineering in coordinating the release of new products. Estimates manufacturing costs, determines time standards, and makes recommendations for tooling and process requirements of new or existing product lines. Maintains records and reporting systems for coordination of manufacturing operations. Qualifications: BSIE or BSMfgE with a strong background in Process Engineering. Supervisory experience is strongly preferred. Must be a self- starter and able to work independently. Candidate should have 5-7 years hands on SMT process experience (Solder Paste Print, Pick and Place, Reflow). Working knowledge of IPC Documentation including IPC-A-610 and J-STD-001. Experience with DOE, DFM, New Product Introductions, Statistical Techniques, SPC, and Continuous Improvement. Processing knowledge of BGA, MicroBGA, and CSP components. Strong MS office skills. Responsibilities: Introduction of new technologies, processes, and equipment into a medium volume, high reliability electronics manufacturing environment. Key to this position is the ability to integrate cutting edge technology (materials, equipment, processes) into a production environment. The successful candidate will be involved in all New Product Introductions, process yield improvements activities such as determining process flow, material usage, machine parameters, performing line balancing, troubleshoot and improvement, and documentation for Work Instructions, as well as new initiatives such as lead-free soldering.

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