Laser Applications Engineer
Date Posted: |
July 24, 2006 |
Job Category: |
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Company Division: |
Synova USA |
Location: |
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Job Description: |
Seeking seasoned Applications Engineer, with communications ability, sales savvy and experience with wafer singulation, lasers, or semiconductor packaging. Role will encompass all aspects of Applications development and Customer Field service involving a unique Swiss based laser/water cutting system for use in next generation wafer singulation and hard materials cutting.
Contact directly for additional details.
San Jose, CA based office. |
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