Manufacturing Engineering Lead--CCA

Provides advanced engineering expertise in support of the design, and integration of highly complex circuit card assemblies.  Technical expertise should include a broad background in circuit card assembly with a strong concentration in surface mount technology/processes. 

Demonstrated process expertise shall include: component Lead Forming, Solder Paste Stencil Printing, Pick and Place, Solder Reflow, Cleaning Systems, Through Hole Assembly, Wave and Selective Soldering, Post Automated Hand Assembly processes, Bonding and Conformal Coating.   Competency in Design for Manufacturing, SPC, Manufacturing Fixture Design is also a plus.

Tasks may include: creation of manufacturing instructions, data analysis, process development, preparation of estimates for bids and proposals, development of plant and facility layouts, etc.  Emphasis is on leadership and coordination of the overall strategic technical direction of Circuit Card Assembly Manufacturing Technology.  Requires the application of engineering standards, principles, theories, concepts and techniques in ways that are highly innovative. A focus on developing best practices and on mentoring others will also be expected.

QUALIFICATIONS:         

A minimum of 5 years’ experience and a BS in Electrical Engineering, Mechanical Engineering or related field.

SECHAN Electronics, Inc.
Attn:  Human Resources
525 Furnace Hills Pike
Lititz, PA 17543-8954
www.sechan.com
EOE
Non-smoking applicants only
For security purposes, only US persons can apply