Electronics Assembly Jobs

Senior Engineer

Date Posted:

July 25, 2000

Job Category:

Engineering

Location:

Brookfield, Wisconsin, USA

Job Description:

SR. ENGINEER � SENSORS -- $60-$80K Company: Well established controls manufacturer that has seen steady growth over the past several years. This company has a history of anticipating and successfully capitalizing on new market needs. Being one of the leaders in their industry, sales are now over $100M/year, and they are once again projecting 15-20% growth by next year. Our client is a high-volume, world class manufacturer of electronic and electromechanical components and systems for Industrial, Medical, and Automotive applications. They are ISO/QS 9000 certified, offer a very clean, modern environment and have been recognized as GM's supplier of the year for two years in a row. Very competitive salary and outstanding benefits in a fast-paced, team oriented company. Above average advancement opportunities exist due to company�s continued growth. Position: This is the latest success story in a series of new product offerings from a company that manufactures a diverse selection of electronic and electromechanical controls. Open due to growth, this is a newly created position that will serve as the #2 engineer (next to the mgr.) for the business unit. Will lead development activities, including providing the direction and mentoring of engineers, technicians, and designers. Will utilize design tools such as circuit simulators and magnetics modeling software. Full project level responsibilities include interfacing with customers, sales, manufacturing, and suppliers. Will also share responsibility with the Mgr. to identify, investigate, and evaluate new sensor product opportunities. Requirements: BSEE and a minimum of 5 to 10 years of electronic product design experience, with proficiency in PRESSURE SENSOR development, with strong preference for automotive or high volume applications. Competency should include circuit board layout, circuit analysis software, piezoresistive pressure sensor technology, along with associated semiconductor processes; (wire bonding, chip on board, solder bump bonding, SMD soldering) and flex circuits. Community: Wisconsin.

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