Electronics Assembly Jobs

Process / Application Engineer

Date Posted:

June 25, 2003

Job Category:



Temecula, California, USA

Willing to Relocate?:


Summary of Qualifications:

Over five years of experence developing semi-conductor, industrial, and electronic packaging applications (i.e., Underfill, SMA, Encapsulation, Dam and Fill, Gasket, Flux, Conformal Coating). Provided technical and process support for automated fluid dispense systems at international and domestic sites.

Special Assignments
�� Managed platform world issues, procedures and implementation of field upgrades as senior field service engineer for Intel��s OLGA platform
�� Developed and managed recovery program for site service and process support of Intel��s OLGA plant in Philippines
�� Contributed to design and testing of dispense systems for new products group

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