Electronics Assembly Jobs

Process Engineer

Date Posted:

October 26, 2007

Job Category:

Engineering

Location:

rochester, New York, USA

Willing to Relocate?:

Yes

Summary of Qualifications:

Skill Set

. ASQ: Certified Six Sigma Green Belt (CSSGB) (Appearing 12/01/2007)
. SMT Process Related Skills
. Stencil Printing
. Reflow Profiling
. Selective Soldering
. Rework
. RSlogix � Programmable Logic Controller
. Minitab 15.1
. Arena - Manufacturing System Simulation
. Lab view - Computer Aided Data Acquisition


Relevant Knowledge

. Fundamental and Advanced Electronics Packaging
. Reliability Statistics in Electronics Manufacturing
. Design of Experiments (DOE)
. Statistical Process Control (SPC)
. Lean Manufacturing
. Project Management
. Quality Engineering
. Cost Accounting
Professional Work

1. Graduate Research Associate - Center for Electronics Manufacturing
and Assembly (CEMA), RIT, (Jan 2006 - Present)

a. Investigating the influence of various parameters (DOE
factors/variables) in minimizing the void formation in
Quad Flatpack No-lead (QFN) assembly using the Lead-Free Solder
Alloys manufactured by Indium Corporation of America
. Formulated DOE to determine the influence of the following
parameters related to the PCB, print process and reflow,
in minimizing void formation (Response) with QFN devices.
a) Influence of stencil aperture design
b) board finish
c) Solder paste flux chemistry
d) Reflow profiles and
e) Use of preforms with reduced paste print
. Correlation of voiding with thermal resistance

b. DOE Implementation to test the performance (under stencil
cleaning efficiency) of stencil cleaning paper manufactured
by Microcare Corp.
. Designed an experiment to analyze the cleaning performance of
two different stencil cleaning papers.
. 11 factors that can potentially affect the cleaning
performance were considered and conducted runs based on classical
DOE treatment combinations.

c. IBM Flex cell, RIT
. Reworked on a flex cell manufacturing cell set up, consists of
three IBM 'Pick and Place' robots and a conveyor,
that assembles pens and inspects the same
. Established communication paths between individual modules
. Designed the control logic using RSLogix to remotely control the set up

d.Tear Down Project:
. Studied the mother board of an Intel Pentium-1 processor of a
personal computer and identified the process flow of its assembly

2. Graduate Teaching Associate - Manufacturing Automation and Control
Systems, RIT, (Mar 2006 - Feb 2007)
. Designed and developed the course material for "Manufacturing
Automation and Control Systems"
. Supervised the laboratory experiments

3. Trainee Engg � INTELTEK Automation Pvt. Ltd, India, (April 2005 � Jun 2005)
. Integrated the electro-mechanical drives with the CNCs and SPMs
controllers by CNC coding and PLC (Programmable Logic Controller)
programming. Calibrated the CNCs and SPMs and retrofitted them if needed.

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