Summary of Qualifications: |
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Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability. A recognized author of numerous technical publications. Extensive experience in Electronic Industry working with high precision equipment.
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An expert in Surface Mount Technology (SMT) and process, documentation, facility layout, Surface Mount equipment selection, new process development. Practiced in the implementation of quality initiatives including IPC, ISO-9000/14000 and other standards
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A proven Team Leader recognized for process improvement, optimization and new product introduction successes with an international reach. Adept in providing training and development to technical professionals around the globe with a record of improving both individual and team performance.
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Excellent problem solving skills.
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