HYBRID/MCM DESIGNER

HYBRID/MCM DESIGNER Description:

This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal length bond wires, or variable radii and distance, or ten other patterns. Bond-pad location, angle, size, shape and layer are easily edited. Automatic power rings. Rectangular or serpentine resistors. Outputs to automatic wire bonders.