SMT Equipment

AW-1008 Plasma Asher Equipment

Company Information:

Professionally provide RTP, PLasma Asher,Descum,Etcher, Sputter deposition, Metal thin film thickness measurement equipment made in U.S.A.

Morgan Hill, California, USA

Manufacturer

  • Phone 001-408-778-7788
  • Fax 001-408-9047168

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(12) products in the catalog

AW-1008 Plasma Asher Equipment

AW-1008 Plasma Asher Equipment

Name:

AW-1008 Plasma Asher Equipment

Offered by:

Allwin21 Corp.

   

AW-1008 Plasma Asher Equipment Description:

sales@allwin21.com

The AW-1008 single-wafer photoresist asher is an automated tool designed as a flexible downstream Microwave plasma photoresist removal system for high-volume wafer fabrication.  The AW-1008 is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production-proven technology.

Key Features:

  1.           Production-proven plasma stripper/Asher system technology.
  2.           5-15% Uniformity. (Process & Hardware dependent.  Optional.)
  3.           Fast strip/ash rate. (Process & Hardware dependent.  Optional.)
  4.           Increased throughput with 3-Axis Integrated Robust Solid Robot.
  5.           Frontside and backside isotropic removal.
  6.           3x 1kW IR Lamp for uniform heating up to 500C.
  7.           75mm-150mm wafer capability.
  8.           Endpoint detection w/Allwin21 SLOPE technology (Optional)
  9.           2 wafer sizes capability without hardware change if necessary.
  10.           Two Fixed cassette stations.  Or, one Fixed & one centering station.
  11.           Can handle 50um thickness wafer
  12.           PC controller with Advanced Allwin21 Software Package
  13.           Up to 4 gas lines with MFC’s
  14.           2.45GHz 1000W Microwave
  15.           Pressure control with Throttle Valve
  16.           Touch screen monitor
  17.           EMO, Interlocks, and Watchdog function
  18.           GEM/SECS II interface, Optional
  19.           Small Footprint : 35”W x 40”D x 55”H (250LBs)
  20.           Made in U.S.A.

Specifications:

  1. Wafer Size: 3 ,4,5,6 inch Capability. Multiple wafer size without hardware charge.
  2. Temperature: 150-350 ºC (±2 ºC) capability
  3. Gas Lines: Up to four gas lines with MFCs. Popular MFC Range: 510 SLM O2 and 1 SLM  N2.
  4. Asher Rate: 1.5u-5u/min. positive photoresist; >8u/min. negative photoresist
  5. Uniformity: 15%,  Process Dependent
  6. Particulate: <0.05 /cm2 (0.03um or greater)
  7. Damage: CV: <0.I V CV-shift for 250A gate oxide
  8. Selectivity: >1000:1
  9. MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
  10. *Contact Allwin21 sales for other applications and specifications

sales@allwin21.com

AW-1008 Plasma Asher Equipment was added in Sep 2007

AW-1008 Plasma Asher Equipment has been viewed 144 times

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