Laser dicing (Synova Laser Microjet.)

Laser dicing (Synova Laser Microjet.) Description:

The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with precision optically encoded stepping motors. Any pattern that can be programmed can be cut into the wafer. Conventional wafer dicing can also be programmed. This is a wet laser process similar to a conventional semiconductor sawing process.