AWPb 300 Fully Automated Wafer Printing / Bumping System

AWPb 300 Fully Automated Wafer Printing / Bumping System Description:

» Fully automated 200 / 300mm EFEM wafer capability

» Patented vibration squeegee technology

» Dual or Single load port available

Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Printer / Bumper system. It is capable of handling 150, 200 and 300mm wafers with either a dual or single FOUP option. A single robotic arm with pre-aligner is used to load and unload wafers onto the automated print stage (EFEM). Utilizing our patented vibration squeegee technology which has proven viability in wafer bumping, the AWPb 300 employs the same technology used by all Milara printers to accomplish ultra fine pitch printing (down to 38um) with 100 percent printing reliability in conjunction with unsurpassed solder brick geometry.

For more information please visit our website