AW-901eR AW-903eR Plasma Etcher Equipment
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AW-901eR AW-903eR Plasma Etcher Equipment Description:
sales@allwin21.com
The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology.
Key Features:
- Production-proven plasma etching system.
- Up to 3%-5% Uniformity.
- Frontside and backside isotropic and anisotropic etch.
- Process Temperature: 6-65°C .
- 75mm-150mm wafer capability.
- Integrated solid robotic wafer handling. Single wafer process.
- Fixed cassette station and wafer aligner/cooling station.
- Can handle 50um thickness wafer.
- PC controller with Advanced Allwin21 Software.
- Endpoint detection with Allwin21 SLOPE technology. (Optional)
- Up to 4 gas lines with MFC’s.
- MKS 13.56 MHz RF Air-Cooled Generator 300W, 600W, or 1000W.
- Pressure control with UPC. Throttle valve is optional.
- Touch screen GUI.
- EMO, Interlocks, and Watchdog function.
- GEM/SECS II (Optional)
- Small Footprint
- Made in U.S.A.
Specifications:
- Up to 6 inch Capability
- Throughput: 30-60 WPH, Process Dependent
- Temperature: 6-65ºC (±2 ºC) capability
- Gas Lines: 4 gas lines with MFCs.
- Etcher Rate: AW-901eR: 0-8000A/minute; AW-903eR: 0-4000A/minute, Process Dependent
- Uniformity: Up to ±3%, Process Dependent
- Particulate: <0.05 /cm2 (0.03um or greater)
- Selectivity: 901eR: 2-20:1 ; AW-903eR: 2-20:1, Process Dependent
- MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime
- * Contact Allwin21 sales for other applications and specifications
sales@allwin21.com
AW-901eR AW-903eR Plasma Etcher Equipment was added in Jul 2008
AW-901eR AW-903eR Plasma Etcher Equipment has been viewed 196 times
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