FINEPLACER® pico ma - Multi-purpose Bonder
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FINEPLACER® pico ma - Multi-purpose Bonder Description:
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.
This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding. Designed for prototyping or low-volume production, R&D and universities.
Highlights
- Placement accuracy up to 5 µm*
- Components from 0.125 x 0.125 mm² to 100 x 100 mm²*
- Working area up to 450 x 122 mm² *
- Supports wafer/substrate sizes* up to 8"
- Supports bonding forces up to 400 N*
- Can be configured as a hot air rework system
- Manual and semi-automatic configurations
* depending on configuration and application
FINEPLACER® systems
The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.
FINEPLACER® pico ma - Multi-purpose Bonder was added in Mar 2011
FINEPLACER® pico ma - Multi-purpose Bonder has been viewed 1501 times
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