Power PCB
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Power PCB |
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Power PCB Description:
Layer:4
Material:FR-4 4/4/4/4oz
Thickness:2.0
Minimum hole:0.35mm
Minimum Tracc/Spacing:12mil/15mil
Application:power supply
Layers: 2--36layers
Max manufacturing size: 640mm*1100mm
Copper foil thickness: 0.5OZ-13OZ
Min line width/space: 3mil/3mil
Min finished holes size: 0.15mm
Aspect ratio: 12:1
Impedance control: +/-10%
Surface treatment: HASL;HASL with Pb free
Immersion Gold; Immersion Tin; Immersion Silver
Gold Finger; Flash Gold; OSP
Materials: FR4, Tg: 130℃/170℃,Rogers,Arlon,Taconic
Bergquist, Thermagon,
Special technique: blind&buried holes, via in pad,
Semi-plating holes, countersinked holes,
Step mounting holes, controlled depth holes
Edge-plating PCB and metal base PCB
Power PCB was added in Dec 2012
Power PCB has been viewed 643 times