KY8030 Series True3D Solder Paste Inspection (SPI)
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KY8030 Series True3D Solder Paste Inspection (SPI) |
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KY8030 Series True3D Solder Paste Inspection (SPI) Description:
Discover the Industry's Highest Performing True3D SPI Solutions
FIND OUT WHY SO MANY MANUFACTURERS IN NORTH AND SOUTH AMERICA RELY ON KOH YOUNG SPI SOLUTIONS
Did you know a majority of printed circuit board (PCB) defects occur during solder printing? Koh Young America’s aSPIre3 system streamlines the solder paste inspection (SPI) process, allowing manufacturers to save time and money without cutting corners.
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Award-winning Inspection Accuracy and Reliability
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Guranteed True3D Accuracy meets Production Rates
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Best-in-class Accuracy with Production Speeds
KY8030 Series True3D Solder Paste Inspection (SPI) was added in Jan 2013
KY8030 Series True3D Solder Paste Inspection (SPI) has been viewed 6089 times
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