HEPCO 9400-1 BGA Solder Sphere Placement System
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HEPCO 9400-1 BGA Solder Sphere Placement System Description:
- The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array.
- Alignment is achieved through precision pins and specific tooling for ease of use, repeatability, and accuracy in sphere placement.
- "Black Contrast" for easy visual inspection or arrays.
- Repeatable process control to insure co-planarity and uniformity. MODEL 9000-1
- Fits virtually all BGA layouts and sphere sizes.
- Self-contained system, no additional air/vacuum required.
- Ideal for Lower Volume Manufacturers, Rework, and Prototyping.
Process:
- Place component in alignment plate.
- Turn vacuum on.
- Remove residual solder and/or contaminates.
- Print flux on the component using appropriate stencil.
- Load wand with sphere's using vacuum pick-up.
- Align Wand using tooling pins.
- Depress foot pedal to release the full array of sphere's.
- Lift block.
- Remove component from carrier.
- Reflow the part using proper profile.
Additional KIT setups:
- Single or multiple component capabilities.
- Custom tooling available.
- Complete set-up achieved in seconds!
- Very minimal operator training necessary.
- Send your drawing or a sample to HEPCO's Engineers
HEPCO 9400-1 BGA Solder Sphere Placement System was added in Apr 2013
HEPCO 9400-1 BGA Solder Sphere Placement System has been viewed 1419 times
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