Thermal pads

Thermal pads Description:

M400 Series thermallyconductive interface materials are applied to fill the air gaps between the heatingelements and the heat dissipation fins or the metal base. Their flexibility andelasticity make them suited to the coating of the very uneven surfaces. Heatcan transmit to the metal housing or dissipation plate from the separateelements or even the entire PCB, which in effect enhances the efficiency andlife-time of the heat-generating electronic components.

Features

Good thermal conductive: 3W/mK

Naturally tacky needing no further adhesive coating

Soft and Compressible for low stress applications

Available in varies thickness

Application

Cooling components to the chassis of frame

High speed mass storage drives

RDRAM memory modules

Micro heat pipe thermal solutions

Automotive engine control units

Telecommunication hardware

Handheld portable electronics

Semiconductor automated test equipment (ATE)