Thermal Phase Change Pad

Thermal Phase Change Pad Description:

PCH-S15 Series thermally conductive interface materialsare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Application
Cooling components to the chassis of frame
High speed mass storage drives
RDRAM memory modules
Micro heat pipe thermal solutions
Automotive engine control units
Telecommunication hardware
Handheld portable electronics
Semiconductor automated test equipment (ATE)