14 pins butterfly package housing

14 pins butterfly package housing Description:

14 PINS BUTTERFLY GLASS PACKAGE
Low temperature glass feed-through package is suitable for Butterfly Type Module, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc.

glass-to-metal sealed package

14 PINS BUTTERFLY CERAMIC PACKAGE
Multilayer ceramic package
Featured as high hermiticity and reliability, ceramic feed-through package is suitable for high power Butterfly Type Packed Module, SOA, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc. It has better performance and more reliable than glass sealed package.

ceramic-to-metal sealed package

PERFORMANCE PARAMETERS:
Hermeticity: ≤1×10-3Pa.cm3/s(He)
Insulation Resistance: ≥1×1010Ω  at 100V DC
Lead Resistance:  ≤30 mΩ
Thickness of Ni /Au plated: 2μm /1.3μm
Standard: MIL-STD-883

MATERIALS                              
1.      CU-W BASE(WCU10/WCU15)
2.      KOVAR FRAME
3.      BLACK CERAMIC FEEDTHROUGH AL2O3
4.      KOVAR/ALLOY42 LEAD
5.      KOVAR SEAL RING
6.      KOVAR PIPE

Other type package housing can be customized. please send us your drawing for further discussion.