Indium8.9 Pb-Free Solder Paste

Indium8.9 Pb-Free Solder Paste Description:

Solves: QFN Voiding | Head-in-Pillow | Graping

Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT.

Indium8.9 Solder Paste Highlights:

Ideal for miniaturized components and fine-pitch assembly

• Designed especially for CSP, 0201, and 01005 components

Robust reflow performance

• Wide process window for flexible reflow profiling
• Optimal wetting to all common surface finishes

First-class printing performance

• Excellent print transfer through tiny apertures with area ratios <0.66
• Long stencil life and forgiving response-to-pause
• High component retention tack prevents components from shifting

Resists voiding

• Low voiding (<5%) for BGAs with via-in-pad technology

Low Cost of Ownership & High Print Yields

• Unsurpassed transfer efficiency for consistent, full volume print deposits (8 mil) results in reduced frequency of insufficients and high first-pass print yields
• Low print pressure and excellent response-to-pause saves time and money on stencils and line changes
• Solvent-free dry-wiping reduces costs

Increased throughput

• Higher print speed and reduced wipe frequency enables short cycle time, high up-time, and high throughput printing

Indium8.9 Solder Paste Family: