Henkel Surface Mount Adhesives
Company Information:
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Henkel Surface Mount Adhesives |
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Henkel Surface Mount Adhesives Description:
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) applications.
Henkel offers a wide range of Chip bonder and Eccobond products to meet the diversity and challenges of today’s manufacturing requirements. Developed using in-process analysis, Henkel’s surface mount adhesives can address high-speed assembly processes while delivering lead-free compatibility with no loss in productivity. The portfolio includes formulations for low-temperature screen printing and dispensing.
Henkel's LOCTITE Sufrace Mount Adhesive Products: |
Cure Schedules |
Application |
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Dispense Adhesives |
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For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. |
90 seconds @ 150°C 3 – 4 minutes @ 125°C |
General-purpose syringe dispense. |
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For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required. |
2 minutes @ 100°C 5 – 6 minutes @ 85°C |
High speed syringe dispense 40,000+ DPH capable. |
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For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Suited where dispense speeds greater than 35,000 dots/h are required. |
90 seconds @ 150°C 3 – 4 minutes @ 125°C |
Very high speed syringe dispense 47,000 DPH capable. |
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Screen Print / Pin Transfer Adhesives |
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Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited where very fast cure is required on high speed SMT lines. Very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive. |
90 seconds @ 150°C |
Stencil print (20 – 150 mm/s) |
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Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where medium print speeds, high dot profile, high wet strength and good electrical characteristics are required. |
90 seconds @ 150°C |
Stencil print (20 – 150 mm/s) |
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Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required. |
90 seconds @ 150°C 2 – 3 minutes @ 125°C |
Stencil print (60 – 150 mm/s) |
Henkel Surface Mount Adhesives was added in Dec 2013
Henkel Surface Mount Adhesives has been viewed 2611 times
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