SuperBot-III Automated IC Programmer
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SuperBot-III Automated IC Programmer |
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SuperBot-III Automated IC Programmer Description:
Fully automated IC Device Programmig System
- The largest device support in the industry
- Utilizes industrial personal computer (with control card inside).
- Built-in servo and vision system mode to quickly and accurately locate and complete chip capture, placement, programming and packaging automatically.
- Eight built-in internal SuperPro 7500 modules. Efficiency is much higher than parallel-production programmers because each module burns chips independently.
- Advantages:
- Modularizing system design capability.
- Improved switching time.
- High throughput (1600 devices per hour). 60x higher throughput rate than SuperBOT-I for eMMC, NAND/NOR Flash, and SPI Flash devices
- Competitive quote.
- Short change-over time. Automatic socket positioning and project loading with barcode scanning
- Compact size
- Remote control for project loading, quality monitoring, volume control, and file security
- Supports standard Tray & Tape Reel and Tube input & output for IC packages. Four pick-and-place nozzles, eight socket-pressing actuators, and two tape feeders
- Supports laser and ink marking
Motion
- Throughput Up to 1600 UPH (units per hour) handler index time with zero programming time for SuperBOT-I.
- Content High performance control card & servo drive system.
- Resolution X axis: (+/-)0.02mm; Y axis:(+/-) 0.02mm; Z axis: (+/-)0.02mm; θaxis: ±0.1°
- Max. stroke X axis: 1000 mm; Y axis: 500 mm; Z axis: 40mm.
- Pick & Place header accuracy (+/-) 0.07mm.
- Operable chip size: min: 2x2 mm; max: 25x25 mm
Vision System
- Two CCD Cameras Upward CCD for IC positioning while the downward CCD for sockets / pick-and-place spot positioning
- Camera 512x512 pixels
- Field of view 30mm x 300mm
- Vision accuracy △x=△y=0.07 mm, △θ=0.1°
I/O Devices
Manual Tray: Manually change one tray each time (Standard equipped with purchase)
Tape-out Device: Heat sealing and pressure sealing modes. Tape width adjustable between 8 and 32mm.
Tape-In Device: YAMAHA pneumatic feeder. Tape width between 8 and 32mm applicable.
Auto Tray Device: Moves blank tray in and passed tray out the machine automatically, marking the tray (optional). Stack up to 15 JEDEC trays.
Tube-In Device: Moves chips in the machine. Use chip guider for different chip width (optional).
Tube-Out Device: Moves chips out the machine.Use chip guider for different chip width (optional).
Tape Ink-Marker: An attachment to the tape-out device. Marks an ink dot on the chip.
Auto Tray Ink-Marker: An attachment to the auto tray device. Scan and put dots on the passed chips.
Laser-Marker: An optional attachment to the tape-out or the auto tray device. Marks up to 4 characters on the passed chips.
Assisted Control
- Built-in Control : PC-based control with Windows XP.
- Display : LCD monitor.
- Data entry : Keyboard & mouse
SuperBot-III Automated IC Programmer was added in Aug 2015
SuperBot-III Automated IC Programmer has been viewed 475 times
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