Xi3400 Automated X-ray Inspection System

Xi3400 Automated X-ray Inspection System Description:

Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up.

The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection equipment for electronic device manufacturers and related applications.

Nordson DAGE’s versatile Xi3400 Automated X-ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the Xi3400’s innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

By leveraging the automation software techniques developed at Nordson YESTECH and combining with Nordson DAGE hardware technology, including the patented Digitial Tomosynthesis Technology, the Xi3400 acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.

The utilization of standard package libraries simplify training and ensure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms, to provide complete inspection coverage with an extremely low false failure rate.

• Automated 2D & 3D inspection
• Variable magnification
• High defect detection
• Low false calls
• Fast throughput
• Quick set-up

Inspection Capabilities

• Modes 2D and 3D operation
• Maximum Board Size: 508mm x 450mm (20” x 18”)
• Clearance: up to 50mm (2”) top & 25mm (1”) bottom
• Minimum Component Size: 01005
• Defects Detected: Part: position, missing, wrong, skew, tombstone
• Lead: bent, lifted, bridging
• Solder: open, insufficient, short, solder balls
• BGA: shorts, voids, position, missing ball