SMT 256B Solder Joint Encapsulant

SMT 256B Solder Joint Encapsulant Description:

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhesive and SMT 256B can encapsulate bumps of a component after dipping the component into SMT 256B adhesive film. During the reflow process, this polymer adhesive removes metal oxide and allows solder joint to be formed; meanwhile, a 3-D polymer network starts to form and encapsulates individual solder joints with enhancing solder joint to eliminate some drawbacks of underfilling (large CTE above Tg, trouble process control). The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The polymer network can be removed using methyl ethyl ketone (MEK) or heating.

• Easy Storage
• Color: Black
• Enhance Solder Strength 5-10x
• High Cost Reduction
• Eliminates Underfill
• Improves Process Yield
• Higher Throughput
• Compatible with Production Lines
• 100% Reworkable