SEMI-AUTOMATED METROLOGY SYSTEM

SEMI-AUTOMATED METROLOGY SYSTEM Description:

Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness Measures Thickness, TTV, Bow, Warp, Site and Global Flatness. Exclusive MTI capacitance sensors for outstanding accuracy and repeatability Full 1000 µm thickness measurement range without re-calibration Measures Thickness, TTV, Bow, Warp and site and Global Flatness Windows® user interface ASTM Standard measurements SEMI S2-0200 health and safety compliant design SEMI S8-0999 ergonomic compliant design Measures all materials including Si, GaAs, Ge, InP, SiC *** *** provided bulk resistivity is less than 20K Ohm/cm