Vapor Degreasing System
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Vapor Degreasing System |
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Vapor Degreasing System Description:
Cleaning Application:
- Cleaning after die bond
- Cleaning of 3D package
- Micro-standoff precisely cleaning
- SIP and microwave assembly cleaning
- Cleaning before chip packaging
- Cleaning before PCBA coating
- Cleaning electronic assemblies with low stand-off,such as: FC,BGA,CSP,BTC,QFN,MELF;
- Apply for assemblies of water-free cleaning
- Factory which doesn’t permit wastewater discharge.
Unique Advantage:
- The third-generation vapor cleaning technology with two types of co-solvent.
- Unique double flow cleaning technology ---- “SUI”,which with high flow spray under immersion sump up to 500L/min.
- Spray under immersion+bubbling+vertically oscillated of basket, even no ultrasonic to achieve perfect cleaning result.(132Hz ultrasonic cleaning optional)
- Waterfree cleaning process is apply for cleaning after die bond,which can rinse the organics thoroughly.
- Multi-cycles vapor rinse to improve flexibility of cleaning process.
- Double refrigeration system+ Double-seal technology, strictly control the volatilization of solvent, no harm to operator and environment friendly.
- Cleaning process can be set flexibly according to cleaning application.
- Wide range of customized basket and fixture.
Vapor Degreasing System was added in Aug 2022
Vapor Degreasing System has been viewed 129 times
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