BGA Re-Ball

BGA Re-Ball Description:

MVINIX has a revolutionary process for BGA Re-Ball. We got rid of our BGA Re-Work machine. Our new process let's us control the temperature to achieve 100% yield with extremely faster turn around times. Over a thousand per week delivered to chipzilla.

We also virtually eliminated solder voids for one of our customers who requested it. Void analysis is available upon request. Void Analysis (X-Ray) is done by a third party and a report is provided. Void reduction is an add-on service. Voids are always present in standard reballing. MVINIX has the technology, process and know-how to reduce or virtually eliminate voids.