BGA Re-Ball
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BGA Re-Ball Description:
MVINIX has a revolutionary process for BGA Re-Ball. We got rid of our BGA Re-Work machine. Our new process let's us control the temperature to achieve 100% yield with extremely faster turn around times. Over a thousand per week delivered to chipzilla.
We also virtually eliminated solder voids for one of our customers who requested it. Void analysis is available upon request. Void Analysis (X-Ray) is done by a third party and a report is provided. Void reduction is an add-on service. Voids are always present in standard reballing. MVINIX has the technology, process and know-how to reduce or virtually eliminate voids.
BGA Re-Ball was added in Aug 2022
BGA Re-Ball has been viewed 69 times