Printed Circuit Board Assemblies
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Printed Circuit Board Assemblies |
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Printed Circuit Board Assemblies Description:
Printed Circuit Board Assemblies
Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies.
Our process capabilities include:
- 01005 chips
- 0.4mm fine pitch IC
- Flip Chip
- CSPs
- BGAs and Micro-BGAs
- PoP (0.4mm pitch package on package)
- 3D Solder Paste Inspection (SPI)
- In-Circuit Test (ICT)
- Automatic Optical Inspection (AOI)
- X-Ray Inspection
Our equipments include:
- 25 SMT lines (more than 50 millions chips placement/day)
- Lead Free Reflow ovens
- Lead Free Dual Wave machines
- Lead Free Selective Soldering machines
- Bonding machines
Valuetronics comprehensive manufacturing capabilities enable us to accommodate our customers’ requirements for volume, mix and complexity. We excel in a variety of volume requirements from low-volume complex custom products to high–volume standards products.
Our highly trained and skilled personnel can offer manufacturing capabilities for a wide range of printed circuit boards, electro-mechanical and box-build assemblies. These capabilities include:
- Plastic Tool Fabrication and Injection Molding
- Printed Circuit Board Assemblies, including complex multi layer boards
- Sub-Assemblies and Full Product Assemblies (Box Build) across a wide variety of segments
- Reliability Engineering and Testing
- Quality Systems
- Materials Procurement
- On-site Program Management
Printed Circuit Board Assemblies was added in Nov 2022
Printed Circuit Board Assemblies has been viewed 252 times