3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160

3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160 Description:

3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160

Equipment overview

The 3D X-ray inspection system ML-MirXT-160 is specially tailored for wafer technology, SMT, packaging inspection, semiconductor and laboratory applications. The equipment is used to detect solder/tin voids and bonding wires generated in the SMT/semiconductor manufacturing process in the electronic industry. Packaging defects such as offset, wire cross short circuit, flip-chip solder ball virtual soldering, flip-chip solder ball short circuit, wire breakage, wire detachment, etc.

Functions and Feature

1. Modular design, user-customized system

2. Multi-axis motion control system enables clear detection from different angles

3. Automatic real-time navigation chart and x-ray image navigation chart function

4. Specially designed OVHM module, the detector can rotate 360 degrees horizontally and tilt 70 degrees

5. Ultra-high-speed, high-definition CT images

6. Product process programming, with automatic detection function, 5-axis interpolation function, visual CNC detection, and unlimited point editing

7. Digital real-time image processing technology, professional configuration HDR image enhancement technology functions

8. Maximum tube voltage: 160KV, maximum power 20W

9. Geometric magnification up to 2100x, total magnification up to 23000x

10. The smallest detection capability can reach: 0.35 micron

11. ovhm technology High magnification bevel detection

Technical specifications

X-ray imaging