Ultra-Thin Peelable Copper Foil,Ultra Thin Foil with Copper Foil Carrier,Peelable Ultrathin Copper Foil
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Ultra-Thin Peelable Copper Foil,Ultra Thin Foil with Copper Foil Carrier,Peelable Ultrathin Copper Foil |
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Ultra-Thin Peelable Copper Foil,Ultra Thin Foil with Copper Foil Carrier,Peelable Ultrathin Copper Foil Description:
Ultra-Thin Peelable Copper FoilUltra-Thin Peelable Copper Foil TD-FEC is ultrathin copper foil produced using vacuum sputtering and electro-deposition technology,Mainly used in IC packaging, FPC micro line. Structure and size of copper can be customized.
Product Characteristics:
1. Peelable ultrathin copper foil and superior heat stability.
2. Low surface profile,high elongation and tensile strenth.
Yancheng Tiandi Insulation Co.,Ltd.
https://www.polyimide-pi.com/polyimide-film-based-fccl.htm
hsinsulation@aliyun.com
hsinsulation@hotmail.com
Tel :+86-139-61986280 Fax : +86-515-69011600
Ultra-Thin Peelable Copper Foil,Ultra Thin Foil with Copper Foil Carrier,Peelable Ultrathin Copper Foil was added in May 2024
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