Very Low Profile Copper Film(HVLP),Very Low Profile ED Copper Foil,HVLP (Hyper Very Low Profile) Copper Foil
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Very Low Profile Copper Film(HVLP),Very Low Profile ED Copper Foil,HVLP (Hyper Very Low Profile) Copper Foil |
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Very Low Profile Copper Film(HVLP),Very Low Profile ED Copper Foil,HVLP (Hyper Very Low Profile) Copper Foil Description:
Very Low Profile Copper Film(HVLP)Very Low Profile Copper Film as Very low profile copper foil is an electrolytic copper foil. It has low surface profile, high elongation and tensile strength,high peeling strength and superior heat stability. The company's current very low profile copper foil specifications are mainly 9μm, 12μm and 18μm. The copper foil have uniform thickness and fine micro-crystal structure, which can be widely used in HDI, FPC, PCB, CCL, FCCL and other fields.
Yancheng Tiandi Insulation Co.,Ltd.
https://www.polyimide-pi.com/polyimide-film-based-fccl.htm
hsinsulation@aliyun.com
hsinsulation@hotmail.com
Tel :+86-139-61986280 Fax : +86-515-69011600
Very Low Profile Copper Film(HVLP),Very Low Profile ED Copper Foil,HVLP (Hyper Very Low Profile) Copper Foil was added in May 2024
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