High Power Led Packaging Ceramic CCL with Optimal Heat Dissipation
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High Power Led Packaging Ceramic CCL with Optimal Heat Dissipation |
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High Power Led Packaging Ceramic CCL with Optimal Heat Dissipation Description:
陶瓷电路板具有良好的热性能和电气性能，是功率型LED封装的理想材料。它特别适用于多芯片（MCM）和直板焊接芯片（COB）的封装，也可以用于其他大功率电力半导体模块的散热电路板。
基板名称：陶瓷金属化基板的定制设计服务
基板材料厚度：0.635毫米
导电层：铜，镍，金
金属层厚度：300微米
表面处理：浸金
金属单面/双面：单面
镀铜通孔：没有
焊锡面膜：没有
High Power Led Packaging Ceramic CCL with Optimal Heat Dissipation was added in Aug 2018
High Power Led Packaging Ceramic CCL with Optimal Heat Dissipation has been viewed 711 times
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