FWF25012 Wafer 2.5mm 180°Vertical (DIP)
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FWF25012 Wafer 2.5mm 180°Vertical (DIP) |
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FWF25012 Wafer 2.5mm 180°Vertical (DIP) Description:
Category | |
Category | Wafer 180°Vertical (DIP) |
Circuits | 2-12 |
Pitch | 2.5mm |
Height | 7.2mm |
Electrical | |
Current Rating | 3.0A AC(rms) |
Voltage Rating | 250V AC(rms)/DC |
Contact Resistance | 20 mΩ Max |
Insulation Resistance | 1000 MΩ Min |
Withstanding Voltage | 800V AC r.m.s |
Temperature Range operating | -25℃+85℃ |
Material and Plating | |
Material-Metal | Phosphor Bronze |
Material - Plating Mating | Tin |
Material - Plating Termination | Tin |
Material - Resin | PA66 UL94V-2 |
FWF25012 Wafer 2.5mm 180°Vertical (DIP) was added in Feb 2019
FWF25012 Wafer 2.5mm 180°Vertical (DIP) has been viewed 79 times
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