SMT Equipment

FWF25019 Wafer 2.5mm 90°Angle (DIP)

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FWF25019 Wafer 2.5mm 90°Angle (DIP)

FWF25019 Wafer 2.5mm 90°Angle (DIP)

Name:

FWF25019 Wafer 2.5mm 90°Angle (DIP)

Category:

Components

Offered by:

Beijing Yuanda Innovation Technology Co., Ltd

   

FWF25019 Wafer 2.5mm 90°Angle (DIP) Description:

Category
Category Wafer 90°Angle (DIP)
Circuits 2-16
Pitch 2.5mm
Height 7.0mm
Electrical
Current Rating 3.0A AC(rms)
Voltage Rating 250V AC(rms)/DC
Contact Resistance 20 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 800V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Phosphor Bronze
Material - Plating Mating Gold/Tin
Material - Plating Termination Gold/Tin
Material - Resin PA6T UL94V-0/PA66 UL94V-0

FWF25019 Wafer 2.5mm 90°Angle (DIP) was added in Feb 2019

FWF25019 Wafer 2.5mm 90°Angle (DIP) has been viewed 84 times

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