FWF25019 Wafer 2.5mm 90°Angle (DIP)
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FWF25019 Wafer 2.5mm 90°Angle (DIP) |
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FWF25019 Wafer 2.5mm 90°Angle (DIP) Description:
| Category | |
| Category | Wafer 90°Angle (DIP) |
| Circuits | 2-16 |
| Pitch | 2.5mm |
| Height | 7.0mm |
| Electrical | |
| Current Rating | 3.0A AC(rms) |
| Voltage Rating | 250V AC(rms)/DC |
| Contact Resistance | 20 mΩ Max |
| Insulation Resistance | 1000 MΩ Min |
| Withstanding Voltage | 800V AC r.m.s |
| Temperature Range operating | -25℃+85℃ |
| Material and Plating | |
| Material-Metal | Phosphor Bronze |
| Material - Plating Mating | Gold/Tin |
| Material - Plating Termination | Gold/Tin |
| Material - Resin | PA6T UL94V-0/PA66 UL94V-0 |
FWF25019 Wafer 2.5mm 90°Angle (DIP) was added in Feb 2019
FWF25019 Wafer 2.5mm 90°Angle (DIP) has been viewed 84 times
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